What role do flex PCBs play in the Internet of Things IoT?
flex PCBs play in the Internet of Things IoT
Whether it’s tracking train arrival times to create reliable transportation schedules, monitoring real-time traffic over satellite for optimized personal GPS navigation or enabling medical devices to work on the go, the Internet of Things IoT has become deeply woven into our technology and daily lives. The emergence of this phenomenon has required changes in PCB form and function to enable the products that make it all possible.
The evolution of flex pcb has played an important role in this shift. These circuit boards are characterized by their flexibility to fit new shapes and high density, making them the perfect choice for new forms of electronics.
While conventional rigid PCBs require a significant amount of space and have a thick dielectric core, flex PCBs use the thinnest substrates available to reduce overall package size and weight. This allows for a more streamlined design that eliminates the need for bulky components and accessories, creating cost-saving opportunities for IoT product developers.
What role do flex PCBs play in the Internet of Things IoT?
A flexible PCB requires a special base material to hold its layers together, such as polyimide or epoxy. These materials help to maintain the PCB’s shape and offer stability under extreme temperatures. The layer structure also affects the impedance of the circuit, determining how fast electricity can travel down each trace. To minimize impedance, a flex PCB is often constructed using a multi-layer design with copper-clad laminate (CCL). This material has excellent thermal control and can handle extreme heat without softening or reducing the integrity of the circuit.
The cladding layer is also used to protect the traces and pads from soldering and assembly processes. This is done by placing a solder mask on the board, which covers the exposed areas and protects them from contamination during processing. The solder mask is typically tin or soft gold, depending on the application. After the solder mask is placed, a coverlay film can be applied to ensure that the pads and traces remain protected during the manufacturing process.
Once the cladding and coverlay are in place, the traces and pads can be copper-plated to complete the fabrication of the flex circuit. This is typically followed by a lamination with a stiffener, which helps to support the PCB during the assembly and manufacturing process. In addition to providing a structural support, the stiffener provides a barrier between the flex circuit and other components.
Flex PCBs are ideal for IoT applications that must withstand a variety of environmental conditions and stress. This includes industrial equipment and vehicles for assembly, material handling and shipping, which must withstand temperature fluctuations, vibrations and other stresses. These harsh environments can cause traditional rigid PCBs to break or malfunction. However, flex and HDI PCBs can provide the flexible design and high-density interconnect needed to keep IoT products functioning even in challenging conditions.
As the world shifts to a smarter, more connected society, IoT is pushing technological development and innovation across a wide range of industries. This progress is being driven by a number of factors, including increased intelligence, miniaturization and flexible designs. These developments are expected to drive further flex PCB innovations and advancements in the future.